3D PLUS is a world leading supplier of advanced high density 3D microelectronic products and die/wafer stacking technology. Our products meet the demand for high reliability, high performance and very small size of today’s and tomorrow’s electronics.
Our patented technology portfolio starts with standard package scale upward to die-size and wafer-level stacking processes. It enables stacking heterogeneous active, passive and opto-electronic devices in a single highly miniaturized package. Comparing to other existing 2D traditional solutions, our technology allows gaining a factor of at least 10 on the weight and volume of the components.
3D PLUS standard products and System-In-Package (SiP) solutions bring breakthrough advantages to our customers’ electronic designs. They are used in diverse computer boards, data recorders boards and custom applications for buses and payloads. Our Flight Heritage is expanding continuously with products launched in Space almost every month in GEO, MEO and LEO orbits, for deep space exploration missions, for satellite constellation fleets, and for governmental missions.
Since our creation in 1995, we have been pursuing a constant growth with today customers spread over 30 countries.