Hi-Rel Electronic Components Distributor
HI-REL ELECTRONIC COMPONENTS
3D PLUS
3D PLUS is a world leading supplier of advanced high density 3D microelectronic products and die/wafer stacking technology. Our products meet the demand for high reliability, high performance and very small size of today’s and tomorrow’s electronics.
Our patented technology portfolio starts with standard package scale upward to die-size and wafer-level stacking processes. It enables stacking heterogeneous active, passive and opto-electronic devices in a single highly miniaturized package. Comparing to other existing 2D traditional solutions, our technology allows gaining a factor of at least 10 on the weight and volume of the components.
3D PLUS standard products and System-In-Package (SiP) solutions bring breakthrough advantages to our customers’ electronic designs. They are used in diverse computer boards, data recorders boards and custom applications for buses and payloads. Our Flight Heritage is expanding continuously with products launched in Space almost every month in GEO, MEO and LEO orbits, for deep space exploration missions, for satellite constellation fleets, and for governmental missions.
Since our creation in 1995, we have been pursuing a constant growth with today customers spread over 30 countries.
Our patented technology portfolio starts with standard package scale upward to die-size and wafer-level stacking processes. It enables stacking heterogeneous active, passive and opto-electronic devices in a single highly miniaturized package. Comparing to other existing 2D traditional solutions, our technology allows gaining a factor of at least 10 on the weight and volume of the components.
3D PLUS standard products and System-In-Package (SiP) solutions bring breakthrough advantages to our customers’ electronic designs. They are used in diverse computer boards, data recorders boards and custom applications for buses and payloads. Our Flight Heritage is expanding continuously with products launched in Space almost every month in GEO, MEO and LEO orbits, for deep space exploration missions, for satellite constellation fleets, and for governmental missions.
Since our creation in 1995, we have been pursuing a constant growth with today customers spread over 30 countries.
RADIATION TOLERANT MEMORY MODULES
- SRAM
- SDRAM
- DDR1, DDR2, DDR3, DDR4
- FLASH NAND, FLASH NOR
- SPI FLASH
- PROM
- MRAM
- RTIMS
- SDRAM
- DDR1, DDR2, DDR3, DDR4
- FLASH NAND, FLASH NOR
- SPI FLASH
- PROM
- MRAM
- RTIMS
RADIATION TOLERANT COMPUTER CORE MODULES (FUSIO RT)
- Modules containing FPGA, configuration FLASH NOR memory and optional SDRAM and FLASH NAND memory
RADIATION TOLERANT INTERFACE MODULES
- LVT
- SerDes (Serializer/Deserializer)
- LVDS
- SerDes (Serializer/Deserializer)
- LVDS
RADIATION TOLERANT POWER MODULES
- POL DC/DC converters
- Termination regulators for DDR2, DDR3 and DDR4 memory
- Termination regulators for DDR2, DDR3 and DDR4 memory
RADIATION TOLERANT CURRENT LIMITER MODULES (LCL)
- Modules for current limiting at the influence of heavy charged particle
RADIATION TOLERANT SWITCH MODULES
- Controlled switch modules with output current monitoring and load disconnecting at overcurrent
RADIATION TOLERANT CAMERA MODULES
- Modules containing CMOS sensor, user-configurable FPGA, SDRAM and FLASH NAND memory
IP CORES
- Reed Solomon encoding and decoding IP cores
- Intelligent memory controller IP cores
- Intelligent memory controller IP cores
INDUSTRIAL
MEMORY MODULES
MEMORY MODULES
- SRAM
- DDR3, DDR4
- FLASH NAND, FLASH NOR
- µSSD PATA
- DDR3, DDR4
- FLASH NAND, FLASH NOR
- µSSD PATA
Contacts
Tel:
Address:
Office 55B, 22, Liteyniy avenue,
St. Petersburg, Russian Federation,
Business Centre “Liteyniy 22”
St. Petersburg, Russian Federation,
Business Centre “Liteyniy 22”
e-mail:
Спасибо! Форма отправлена
Спасибо! Форма отправлена
Спасибо! Форма отправлена